Principle WETS Module Engineer
Core
Provide technical leadership and strategic ownership of wet process technologies supporting 300mm wafer manufacturing for Automotive, Industrial, and Consumer applications.
Role type
Principal WETS Module Engineer
Builds
300mm semiconductor wafers for Automotive, Industrial, and Consumer applications
Domain
Semiconductor manufacturing (300mm)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE, SPC, APC, FDC, advanced data analytics, root cause investigation, corrective actions, process qualification, yield analysis, RCA, FMEA, process characterization, high-volume manufacturing
Preferred skills
Mentorship, cross-functional technical leadership
Technologies
SCREEN, TEL, SICONEXX
Responsibilities
Lead module-level yield, defect reduction, cost, and throughput improvements; Drive DOE, SPC, APC, FDC, and advanced data analytics initiatives; Lead root cause investigations and corrective actions for complex excursions; Develop qualification strategies for new processes, hardware upgrades and installations; Mentor engineers and provide cross-functional technical leadership
Seniority
Principal, hands-on IC with strategic ownership