CareerPlan

2026 Q4 - Artificial Intelligence Intern

Wilayah Persekutuan Kuala Lumpur, MalaysiaInternship2026-10-06 → 2026-11-09

Core

Support automation and integration efforts across manufacturing processes, specifically focusing on 'Lights Off' manufacturing concepts and AI integration in workflows.

Role type

Intern, Smart Manufacturing Automation

Builds

Automated manufacturing flows and system architectures for Wafer Bump and Die Bond operations

Domain

Semiconductor manufacturing / Industrial Automation

Deliverable

production ML models

Required skills

System integration, Automation flow design, Data analysis, Parameter fine-tuning, Engineering documentation, Cross-functional collaboration

Preferred skills

Analytical skills, Problem-solving, Time management, Initiative