Test & Plating Process Engineer (MES Project)
Core
Lead the digital design of Test & Plating manufacturing processes and drive MES implementation to optimize yield and efficiency.
Role type
Process Engineer (MES Project)
Builds
Digital process controls, automated holds, rework loops, and material disposition workflows for semiconductor manufacturing.
Domain
Semiconductor manufacturing (Test & Plating)
Required skills
Semiconductor process experience, statistical process control, engineering change control, process release strategies, digital process design, workflow validation
Preferred skills
MES platform experience (Siemens OpCenter), PAC-related integration knowledge, wedge bonding optimization, die attach accuracy optimization
Technologies
MES platforms, Siemens OpCenter, PAC systems
Responsibilities
Define process flows, routing, material handling, and traceability within MES; Design digital logic for process controls and exception handling; Align requirements between manufacturing and quality teams; Validate digital workflows and support UAT and deployment; Manage process stability and optimize parameters using MES data.
Seniority
Mid-level, hands-on IC