CareerPlan

Test & Plating Equipment Engineer (MES Project)

Wilayah Persekutuan Kuala Lumpur, MalaysiaFull-time2026-10-07 → 2026-11-10

Core

Specialized Equipment Engineer driving digital transformation of Test and Plating lines via MES implementation and subsequent production optimization.

Role type

Senior IC equipment engineer (semiconductor manufacturing)

Builds

MES-integrated test and plating workflows, recipe controls, and data collection systems for high-volume manufacturing

Domain

Semiconductor manufacturing (Test and Plating)

Required skills

Semiconductor equipment experience (Test and Plating), MES implementation, data integration, validation, equipment reliability management, SPC techniques, cleanroom protocols

Preferred skills

Siemens OpCenter or comparable MES platforms, PAC-related integration, tool monitoring software, equipment maintenance documentation, cross-functional collaboration

Technologies

MES platforms (Siemens OpCenter), PAC systems, tool monitoring software, SPC tools

Responsibilities

Define MES workflows, recipe controls, and equipment states; translate equipment requirements into digital designs; validate integration scenarios and support UAT; manage equipment reliability and optimize throughput using MES data

Seniority

Mid-level, hands-on IC