Mold and Symbol Trim Form (EOL) Equipment Engineer (MES Project)
Core
Specialized Equipment Engineer driving digital transformation of End-of-Line (EOL) manufacturing for Mold and Symbol Trim Form (STF) operations via MES implementation.
Role type
Senior IC Equipment Engineer (MES Project)
Builds
Digital process designs, data collection needs, and MES-integrated equipment workflows for high-volume semiconductor manufacturing.
Domain
Semiconductor manufacturing (EOL)
Required skills
Hands-on semiconductor equipment experience (Mold/STF), MES implementation, equipment workflow definition, validation & UAT support, digital process design, equipment reliability management, troubleshooting MES-related issues.
Preferred skills
Tool monitoring/interdiction software, SPC techniques, Siemens OpCenter or comparable MES platforms, PAC-related integration, semiconductor cleanroom protocols.
Technologies
Siemens OpCenter, Towa, ASM, Besi, PAC systems
Responsibilities
Define equipment workflows, setup/recipe controls, and interlocks for Mold and STF machines; Translate physical shop-floor requirements into digital process designs; Validate equipment integration scenarios and support UAT; Manage equipment reliability and drive continuous improvement in automation and uptime.
Seniority
Senior, hands-on IC