Die Prep Process Engineer (MES Project)
Core
Lead the digital design of Die Prep manufacturing processes and drive MES implementation to optimize yield and efficiency.
Role type
Process Engineer (MES Project)
Builds
Digital process controls, workflow definitions, and exception handling for Die Prep/Dicing operations.
Domain
Semiconductor manufacturing (Die Prep/Dicing)
Required skills
Die Prep process experience, statistical process control, engineering change control, process release strategies, workflow definition, exception handling
Preferred skills
MES platform experience (Siemens OpCenter), PAC integration awareness, backgrind/dicing/laser saw process knowledge, analytical problem solving
Technologies
MES platforms (Siemens OpCenter), PAC systems
Responsibilities
Define flows, routing, and material handling for Die Prep processes; Validate workflows with quality and manufacturing teams; Support UAT and deployment; Utilize MES data for process optimization and yield analysis.
Seniority
Mid-level, hands-on IC