Die Prep Equipment Engineer (MES Project)
Core
Specialized Equipment Engineer driving digital transformation of Die Prep lines via MES implementation and subsequent production optimization.
Role type
Senior IC equipment engineer (semiconductor Die Prep/MES)
Builds
Digital workflows, recipe controls, and data collection points for Die Prep equipment
Domain
Semiconductor manufacturing (Die Prep/Dicing)
Required skills
Semiconductor equipment experience (Die Prep/Dicing), MES platform configuration, hardware-to-digital translation, validation of integration scenarios, predictive maintenance strategies
Preferred skills
Backgrind/Mechanical/Laser Saw experience, PAC-related integration, tool monitoring software, SPC techniques, cleanroom protocols
Technologies
Siemens OpCenter, MES platforms, PAC systems
Responsibilities
Define workflows and equipment states for MES rollout, translate hardware requirements into digital designs, validate integration scenarios and support UAT, maintain equipment reliability and leverage MES data for automation
Seniority
Mid-level, hands-on IC