Field Applications Program - Digital (Texas Region)
Core
12-month rotational program preparing rising Field Applications Engineers (FAEs) to solve customer design challenges and maximize TI revenue through systems-level solutions.
Role type
Field Applications Engineer (FAE) trainee
Builds
Systems-level solutions for customer designs
Domain
Semiconductor / Electrical Engineering
Deliverable
production ML models | product features | client delivery
Required skills
component selection, schematic/layout capture, PCB layouts, fabrication processes, board bring up and validation, C/C++ programming, lab equipment operation, soldering, debugging
Preferred skills
C/C++ programming, LabView, analytical problem solving, communication, teamwork, time management, relationship building
Technologies
C, C++, LabView, oscilloscopes
Responsibilities
Analyze technical trade-offs, understand component selection, solve design and cost challenges, create new and efficient sales processes, leverage TI resources, automate selling techniques, interact directly with customers, participate in innovative projects, train on business acumen, technical capabilities, and processes for new product definition and introduction
Seniority
Entry-level, rotational program