Execution Process Engineer (SM1)
Core
Lead quality event management, process stability, and operational improvements in a 300mm semiconductor manufacturing facility.
Role type
Execution Process Engineer (IC)
Builds
Next-generation semiconductor products and manufacturing processes
Domain
Semiconductor manufacturing (300mm wafer fabrication)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical process control (SPC), engineering change control, process release strategies, root cause analysis, data analysis, problem-solving, equipment troubleshooting
Preferred skills
Plasma etch, rapid thermal processing, metrology, yield enhancement techniques, risk mitigation, Smart Manufacturing and Automation (SMA) implementation
Technologies
300mm wafer fabrication tools, SPC software, automation systems
Responsibilities
Lead quality event management and resolve quality excursions; Develop strategies for handling out-of-control and out-of-specification lots; Own Statistical Factory Control and improve inline performance; Identify opportunities to maximize output and reduce cycle time; Create tools to improve team efficiency and document learnings
Seniority
Mid-level, hands-on IC