CareerPlan

Principal Equipment Engineer (Multiple Positions) #1599

USA-ArizonaFull-time2026-07-06 → 2026-11-10
On-site

Core

Retrofit component and parameters settings to improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment. Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner.

Role type

Principal Equipment Engineer (Semiconductor Manufacturing)

Builds

Semiconductor manufacturing equipment (diffusion, thin film, lithography, etching)

Domain

Semiconductor manufacturing / Hardware engineering

Required skills

Semiconductor manufacturing principles and techniques, Hardware systems knowledge (mechanical, pneumatics, electrical), CAD software (Creo, Pro-E, AutoCAD, Solidworks), Root cause analysis, Project planning and scheduling, Team leadership

Preferred skills

Physics and chemistry principles as they apply to semiconductor lithography processes, Robotics systems knowledge

Technologies

Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, Solidworks

Responsibilities

Solve critical equipment issues to improve tool uptime and utilization efficiency, Implement best known methods in hardware to control tools performance, Identify and pursue opportunities for hardware capability enhancement to drive defect reduction, Communicate with cross-function engineers or vendors and serve as a module liaison

Seniority

Principal, hands-on IC with mentorship