Principal Equipment Engineer (Multiple Positions) #1599
Core
Retrofit component and parameter settings to improve tool performance and availability for diffusion, thin film, lithography, or etching equipment in a semiconductor fab; install and qualify new tool sets to add capacity.
Role type
Principal Equipment Engineer (Semiconductor Manufacturing)
Builds
Semiconductor chips using leading-edge process technology (N4, N3, N2, 2nm)
Domain
Semiconductor manufacturing / Equipment engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing principles and techniques, Hardware control systems, Planning and scheduling for tool install construction projects, Mechanical systems knowledge (lithography track robotics, pneumatics, electrical systems), Physics and chemistry principles for lithography processes, Root cause analysis for complex defect and hardware issues, Team leadership
Preferred skills
Experience with Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, or Solidworks
Technologies
Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, Solidworks
Responsibilities
Solve critical equipment issues to improve tool uptime and utilization efficiency; Implement best known methods in hardware to control tool performance; Identify opportunities for hardware capability enhancement to drive defect reduction; Communicate with cross-function engineers, vendors, facilities, and manufacturing shift personnel
Seniority
Principal, hands-on IC with mentorship