Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381
Core
Improve tool performance and availability for Chemical Mechanical Polishing (CMP) equipment in a clean room environment to support leading-edge semiconductor manufacturing.
Role type
Senior IC equipment engineer (CMP)
Builds
5nm and beyond logic chip manufacturing capacity
Domain
Semiconductor manufacturing (CMP equipment)
Required skills
CMP basic principles, semiconductor manufacturing processes, wafer surface defect analysis, material removal rate analysis, equipment parameter adjustment, robotic arm operation, C++, Python, UNIX, 3D CAD (Creo/Pro-E/AutoCAD/Solidworks), MATLAB, COMSOL, OrCAD
Preferred skills
None stated
Technologies
CMP equipment, robotic arms, C++, Python, UNIX, Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, OrCAD, Solidworks
Responsibilities
Solve critical equipment issues to improve uptime and utilization; identify hardware capability enhancement opportunities; drive root cause analysis on process escalations; install and qualify new tool sets for 5nm+ equipment; communicate with cross-functional engineers and vendors.
Seniority
Senior, hands-on IC