Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381
Core
Improve tool performance and availability for Chemical Mechanical Polishing (CMP) equipment in a semiconductor fab, ensuring timely installation and qualification of new tool sets for 5nm or beyond processes.
Role type
Senior IC Equipment Engineer (CMP)
Builds
Semiconductor manufacturing capacity for leading-edge logic chips (5nm and beyond)
Domain
Semiconductor manufacturing / Advanced process technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor manufacturing principles, CMP basic principles, wafer surface defect analysis, equipment parameter adjustment, material removal rate analysis, robotic arm operation, C++, Python, UNIX, 3D CAD (Creo/Pro-E/AutoCAD/Solidworks), MATLAB, COMSOL, OrCAD
Preferred skills
Experience with 5nm or more advanced tools maintenance and qualification
Technologies
C++, Python, UNIX, Creo 3D CAD, Pro-E, AutoCAD, MATLAB, COMSOL, OrCAD, Solidworks
Responsibilities
Solve critical equipment issues to improve uptime and utilization; Identify hardware capability enhancement opportunities to drive defect reduction; Drive root cause analysis and corrective actions for process escalations; Install and qualify new tool sets according to planned schedules; Communicate with cross-functional engineers, vendors, and shift personnel
Seniority
Senior, hands-on IC