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Engineer for TAK ICP dry etching process

Japan - Tokyo (Takao)💼 Full-time🗓 2026-06-26 → 2026-09-26

Core

Develops and optimizes InP-based lithography and dry etching processes for optical semiconductor wafer production, scaling from pilot to mass manufacturing.

Role type

Process Engineer (Dry Etching / Lithography)

Builds

InP-based optical semiconductor wafers and etching process equipment setups

Domain

Semiconductor manufacturing, Optical semiconductors, Wafer processing

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Dry etching process development, Auto wet etching, Lithography, Wafer process production technology, Equipment automation, Process improvement

Preferred skills

Oxide film deposition, Sputtering, Metal deposition

Technologies

Dry etching equipment, Auto wet etching equipment, Lithography tools

Responsibilities

Define etching conditions and equipment specifications, introduce new etching process equipment, plan projects for new concepts and automation, apply developed technologies in product fabrication and evaluation

Seniority

Mid-level, hands-on IC

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