Principal Thin Film Process Engineer
Core
Technical lead for Sputter Deposition (PVD) and Electron Beam (EB) Evaporation processes to scale and sustain High-Volume Manufacturing (HVM) of complex dielectric, oxide, and metal coatings.
Role type
Principal Thin Film Process Engineer (Technical Lead)
Builds
High-volume manufacturing toolsets for semiconductor wafers
Domain
Semiconductor Manufacturing / Thin Film Deposition
Required skills
Sputter Deposition (DC, RF, Reactive), EB Evaporation, Root Cause Analysis (RCA), FMEA, Statistical Process Control (SPC), Design of Experiments (DOE), Equipment Procurement & Qualification, Team Coaching
Preferred skills
Python, MATLAB, JMP, Minitab, Defect Metrology
Technologies
Python, MATLAB, JMP, Minitab, PLCs, Turbo Pumps, MFCs, Pressure Controllers, Ellipsometry, SEM-EDX, TEM, AFM, XPS, FIB, XRR, SAXS, FTIR
Responsibilities
Provide strategic direction and technical oversight for PVD and EB Evaporation processes; Lead integration of process changes across PLCs and control interfaces; Drive Continuous Improvement Projects (CIP) for cycle-time optimization and Cost of Ownership reduction; Lead complex Root Cause Analysis (RCA) and FMEA for yield detractors; Develop automated process health monitors; Own end-to-end lifecycle of new equipment procurement and qualification; Partner with cross-functional teams for process qualifications; Coach and develop a team of process engineers and technicians.
Seniority
Principal, strategic lead with hands-on technical mastery