Internship - Mechanical Engineer
Core
Develop mechanical structures for new Cloud Module products from chip and component level up to transceiver level, ensuring thermal performance and signal integrity.
Role type
Mechanical Engineering Intern
Builds
Product prototypes and new chip, component, and Module designs
Domain
Opto-mechanical engineering / Semiconductor packaging
Deliverable
product features
Required skills
Mechanical design, GD&T analysis, Thermal stress analysis, DFM activities, CAD drafting
Preferred skills
FEA software (ANSYS), Opto-mechanical design experience, Production development experience
Technologies
SolidWorks, ANSYS
Responsibilities
Provide ideas for new chip, component, and Module design; Build product prototypes; Perform thermal stress analysis; Perform GD&T analysis; Involve DFM activities
Seniority
Intern