Packaging Quality Engineer
Core
Ensure operational consistency in semiconductor packaging manufacturing by managing quality control protocols, process audits, and supply chain risks for optical interconnects.
Role type
Packaging Quality Engineer (Semiconductor OSAT)
Builds
High-volume production lines for optical interconnects and networking components
Domain
Semiconductor manufacturing / Optical networking / Supply chain quality
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), Failure Analysis, Quality Assurance methodologies (OCAP, FMEA, APQP), Supplier Quality Management, Process Auditing, Yield Analysis, Root Cause Troubleshooting, Data Analysis
Preferred skills
Semiconductor substrate knowledge, Cross-functional collaboration, Advanced statistical analysis, Stakeholder negotiation
Technologies
SPC tools, OCAP, FMEA, APQP frameworks
Responsibilities
Establish quality control protocols for bumping, die attach, wirebonding, and flip-chip processes; Oversee SPC implementation for real-time monitoring; Conduct on-site audits of OSAT partners; Analyze quality metrics to mitigate supply chain risks; Drive continuous improvement initiatives for yield and reliability.
Seniority
Mid-Senior, hands-on IC