Physical Failure Analysis Engineer
Core
Deliver professional failure analysis and characterization solutions by performing hands-on physical preparation for root-cause isolation of silicon devices and advanced products.
Role type
Senior IC physical failure analysis engineer (sample preparation)
Builds
Root-cause isolation data for next-generation silicon devices, packaged components, and multi-layer boards
Domain
Semiconductor manufacturing / Failure analysis
Deliverable
physical/clinical work
Required skills
mechanical cross-sectioning, CNC-based planar polishing, wet and dry etching, optical microscopy, 3D spatial visualization, technical reporting, sample traceability management
Preferred skills
Focused Ion Beam (FIB) cross-sectioning, broad-beam argon ion milling (BIB), nano-probing sample prep, advanced packaging support, FT-IR and GC analytical techniques
Technologies
CNC polishers, SEM, EDS, optical microscopy, Keynote
Responsibilities
Perform precision mechanical cross-sectioning, encapsulation, parallel lapping, and polishing for silicon and multi-layer boards; Develop and optimize chemical and physical delayering methods; Execute decapsulation and etching workflows; Conduct optical inspection and screening; Prepare clear technical reports summarizing methodologies and findings; Evaluate and qualify new sample preparation equipment and techniques.
Seniority
Senior, hands-on IC