CareerPlan

Camera Module Design Lead

Shanghai, ChinaFull-time2026-10-20 → 2026-11-10

Core

Design and develop groundbreaking camera systems (sensor to lens) and depth-sensing hardware for Apple products, leading from concept to mass production.

Role type

Senior IC camera module design lead

Builds

High-performance, compact camera modules and depth-sensing hardware for Apple products

Domain

Consumer electronics / Optomechanics / Imaging systems

Required skills

Camera module and imaging system design, Optical component design, Actuator and translational mechanism design, Electronic circuit and system design, Geometric optics and image quality evaluation, Sensor design and characterization, Compact module manufacturing processes, Failure analysis techniques, Root-cause and corrective-action analysis, Statistical analysis and data visualization

Preferred skills

Experience in optomechanical products or semiconductor industry, Leading multi-functional engineering teams through R&D, Cross-functional team influence and risk management, Decision making with limited information, Fast-paced development schedule delivery

Technologies

Optical microscopy, X-ray, CT scans, SEM, Active alignment, Flex attachment, Sensor attachment

Responsibilities

Define and trade-off studies of RGB camera and depth-sensing optics, sensors, actuators, and packaging; Lead offshore manufacturing partners on design evaluation, prototype builds, and qualification; Lead failure analysis and corrective action implementation at manufacturing sites; Evaluate and debug camera/depth-sensing HW at module and product levels; Document camera-specific design, test, and manufacturing requirements; Manage international travel to supplier facilities for product development and production bring-up