Process Development Engineer ( Precision Bonding )
Core
Lead development and improvement of sub-micron order precision assembly processes, specifically adhesive and thermal compression bonding for plastic materials, to enhance product quality and performance.
Role type
Process Development Engineer (Precision Bonding)
Builds
Next-generation Apple camera hardware components
Domain
Consumer electronics / Optical engineering
Required skills
Thermal bonding technologies, Sub-micron high-precision assembly, 3D-CAD design, Failure analysis, Technical documentation, Statistical analysis (DOE)
Preferred skills
High-precision assembly equipment development, FEA, Mass production adaptation, Chemistry knowledge
Technologies
UV curing, Thermal curing, Ultrasonic welding, Laser welding, Hot plate welding, 3D-CAD
Responsibilities
Design jigs and tools for process development, Conduct evaluation of bonded joint strength and durability, Perform root cause analysis for manufacturing failures, Adapt developed processes to mass production
Seniority
Mid-level, hands-on IC
