CareerPlan

Principal Firmware Engineering Manager

United States, Washington, RedmondFull-time2026-10-21 → 2026-11-10

Core

Leading firmware architecture, design, and development for low-level hardware interfaces, boot flows, and diagnostics across ASIC and SoC platforms.

Role type

Principal Firmware Engineering Manager

Builds

Firmware solutions for Data Center class technologies and SoC platforms

Domain

Semiconductor / Embedded Systems / Data Center

Required skills

Firmware architecture, low-level driver development, hardware/firmware security primitives, platform initialization, BSP integration, multi-threading, interrupt handling, memory management, SoC design, embedded software development, cross-functional team leadership, organizational change management

Preferred skills

Experience with PCIe, I2C, eMMC, SPI, USB, UARTs, OS primitives, scheduling, diagnostics and debugging

Technologies

PCIe, I2C, eMMC, SPI, USB, UARTs, SoC, ASIC, BSP, Embedded Linux/RTOS (implied by OS primitives)

Responsibilities

Drive architecture and design of firmware sub-systems and low-level hardware interfaces; define boot flows for ASIC; lead firmware-level diagnostics and debug; architect and deliver new Data Center technologies; collaborate with external partner teams on design changes; drive organizational changes in design and architecture; troubleshoot and debug embedded software solutions from concept to shipping.

Seniority

Principal, hands-on IC with leadership responsibilities