Sr. Process Engineer - Diffusion (Multiple Positions) #8995
Core
Lead design and execution of experiments to optimize leading-edge semiconductor manufacturing processes (N4, N3, N2, 2nm) and achieve precision control at atomic levels.
Role type
Senior IC process engineer (diffusion)
Builds
Leading-edge integrated modules for TSMC's customers
Domain
Semiconductor manufacturing (diffusion, ion implantation, anneal)
Required skills
Statistical process control, Design of Experiment (DOE), multivariate data modeling, metrology (TEM, SEM, CD-SEM, EDS, FIB, AFM, XRD, Emission Spectroscopy, Raman Spectroscopy, Spectroscopic Ellipsometry, Quartz PCI, FT-IR), wafer cross section techniques, wafer fabrication processes, ion transport phenomena, DRAM, plasma etching, plasma simulation, semiconductor thin film deposition, Atomic Layer Deposition (ALD), 3D NAND Flash, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), semiconductor ion implantation (5nm or below), semiconductor RTA anneal (5nm or below)
Preferred skills
None stated
Technologies
None stated
Responsibilities
Apply statistics process control methods to establish and sustain a robust manufacturing process; Supervise the installation and maintenance of manufacturing equipment to expand capacity; Collaborate with equipment and material suppliers to identify technology gaps and devise mitigation solutions
Seniority
Senior, hands-on IC