TSMC Module Engineering Managers
Core
Manage semiconductor fabrication modules (CMP, CVD, Diffusion, Etch, Lithography, Metrology, PVD) to ensure high-quality wafer production, yield, and equipment performance in a 4-nanometer fab.
Role type
Senior IC Module Engineering Manager
Builds
High-quality semiconductor wafers for global chip manufacturers
Domain
Semiconductor manufacturing / Semiconductor equipment
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
People management, process integration, yield improvement, equipment troubleshooting, resource planning, cross-functional collaboration, SOP control, defect/yield analysis
Preferred skills
Talent development, process optimization, vendor collaboration, budget management
Technologies
CMP, CVD, Diffusion, Dry Etch, Wet Etch, Lithography (EUV/DUV), Metrology, PVD, ETC tools, EUV Scanners
Responsibilities
Lead module process and equipment improvements, manage teams of engineers and technicians, ensure 7x24 production line operation, establish workflow and corrective action plans, collaborate with process integration and manufacturing teams, drive defect and yield improvements
Seniority
Senior, hands-on IC with people management
