CareerPlan

头戴结构材料工程师

Dongguan, ChinaFull-time2026-10-16 → 2026-11-11

Core

Lead end-to-end structural development for high-end over-ear audio products, focusing on lightweighting, waterproofing, and precision mechanisms.

Role type

Senior IC structural engineer (over-ear headphones)

Builds

Over-ear headphones with precision adjustment mechanisms, acoustic cavities, and lightweight frames

Domain

Consumer electronics / Audio hardware

Required skills

3D modeling, precision mechanism design, lightweighting, mold design, material selection, waterproofing, cross-functional collaboration

Preferred skills

Brand headphone mass production experience, human factors engineering, reliability testing standards

Technologies

Creo, AutoCAD

Responsibilities

Lead structural development for ID/CMF feasibility, stacking, and waterproofing; Design 3D models for core modules like headband sliders and earcup hinges; Collaborate on component layout for PCB, battery, and drivers; Drive tooling, prototyping, and assembly process development; Optimize materials and processes for cost and manufacturability