CareerPlan

Packaging Engineer (Chippewa Falls, WI)

Chippewa Falls, Wisconsin, United States of AmericaFull-time$74k–$170k2026-11-09 → 2026-11-10

Core

Design, analyze, develop, and validate packaging solutions (crating, corrugated, foam) for HPE HPC products, ensuring reliability and cost-efficiency.

Role type

Packaging Engineer

Builds

Protective packaging systems for high-performance compute hardware

Domain

Hardware manufacturing / Logistics / Sustainability

Required skills

Mechanical design, 3D CAD (SolidWorks, CREO), fragility testing (shock, vibration, drop), BOM management, cost optimization, analytical problem-solving

Preferred skills

None stated

Technologies

SolidWorks, CREO, shock/vibration/drop-test equipment

Responsibilities

Design and validate packaging for HPC products; lead fragility testing; prepare technical documentation; maintain BOM for sustainability/EPR; identify cost-saving opportunities; support manufacturing teams.

Seniority

Mid-level (2-5 years experience)