Mechanical Technical Lead Engineer
Core
Lead the design, development, and technical ownership of complex mechanical and electro-mechanical subsystems for wafer fabrication equipment (WETS Deposition tools).
Role type
Senior IC mechanical technical lead engineer
Builds
Fluid and pneumatic mechanical subsystems for semiconductor manufacturing tools
Domain
Semiconductor equipment / Wafer fabrication
Required skills
Mechanical design, 3D CAD (Solid Edge, Siemens NX), Fluid dynamics, Thermal analysis, FMEA, Problem-solving (5-Why, Fishbone), OEM component selection, Polymer material design
Preferred skills
High-reliability hardware ownership, Semiconductor material expertise (metals, ceramics, quartz), Structural/FEA analysis, Requirements definition, DfX knowledge, GD&T, Manufacturing knowledge (machining, welding, additive)
Technologies
Solid Edge, Siemens NX
Responsibilities
Design and develop fluid and pneumatic mechanical subsystems; Apply engineering first principles to solve thermal and fluid dynamics problems; Perform OEM component selection; Design components using plastic and polymer materials; Lead or contribute to FMEA; Drive issue resolution using structured problem-solving methods; Collaborate with cross-functional teams; Own subsystem delivery from concept through qualification and release; Support prototype build, testing, debugging, and qualification activities; Maintain clear documentation of designs, calculations, risks, and decisions
Seniority
Senior, hands-on IC