Mechanical Engineer 4
Core
Design and develop mechanical components, assemblies, and subsystems for complex semiconductor manufacturing equipment, specifically wet plating process hardware.
Role type
Senior IC mechanical engineer (semiconductor equipment)
Builds
Wet plating process equipment (Sabre and Sabre 3D products)
Domain
Semiconductor manufacturing / Wet equipment
Required skills
Mechanical design, 3D CAD (Creo/NX), tolerance analysis, thermal-mechanical analysis, structural integrity analysis, failure analysis, NPI phase-gate execution, supply chain collaboration
Preferred skills
Electroplating knowledge, semiconductor industry experience, metal machining, plastics machining, elastomeric seals, coating commodities
Technologies
Creo, NX
Responsibilities
Design and develop mechanical components, assemblies, and subsystems for complex semiconductor manufacturing equipment; Translate subsystem-level requirements into detailed mechanical designs, layouts, and drawings; Perform engineering analysis (e.g., tolerance analysis, thermal-mechanical considerations, structural integrity) to support design decisions; Collaborate with cross-functional teams including Systems, Process, Electrical, Controls, Software, and Manufacturing Engineering to ensure successful subsystem integration; Support NPI phase-gate activities (Pre-DR, DDR, CDR, FDR) by delivering assigned mechanical design milestones on schedule; Participate in design reviews, risk assessments, and failure analysis, contributing to DFMEA and corrective action efforts; Create and maintain 3D CAD models, detailed drawings, and engineering documentation in accordance with Lam standards; Work with external Supply Chain partners to ensure designs are manufacturable, serviceable, and cost-effective; Contribute to sustaining engineering efforts and field issue resolution as needed.
Seniority
Senior, hands-on IC