CareerPlan

TW Engineer - FS II, TF, ECP

TW-Tainan-01 (3102)Full-time2026-05-28 → 2026-10-24
Hybrid

Core

On-site repair, maintenance, and troubleshooting of semiconductor capital equipment at customer sites to ensure operational excellence.

Role type

Field Service Engineer (Physical/clinical work)

Builds

Semiconductor capital equipment maintenance and repair services

Domain

Semiconductor manufacturing equipment

Deliverable

physical/clinical work

Required skills

Interpreting electrical and mechanical schematics, cleanroom environment work, physical mobility for extended periods, travel flexibility, shift flexibility

Preferred skills

Electronics field experience, basic computer skills, analytical and problem-solving skills

Technologies

Microsoft Office Suite

Responsibilities

Provide on-site repair and maintenance of Lam's equipment, troubleshoot equipment problems and conduct diagnostic procedures, identify corrective actions for malfunctions, assist with installation, start-up, or relocation of equipment, maintain knowledge of semiconductor capital equipment through training