SFS Advanced Packaging Application Engineer
Core
Technical bridge between customers and R&D validating next-generation ZEISS 3D X-ray systems and developing advanced semiconductor packaging applications.
Role type
Application Engineer (Semiconductor Metrology)
Builds
3D X-ray systems for semiconductor manufacturing
Domain
Semiconductor Manufacturing Technology / Optoelectronics
Required skills
3D X-ray systems expertise, semiconductor back-end processes knowledge, advanced packaging knowledge, test procedure generation, prototype troubleshooting, X-ray/CT industry experience, test data validation
Preferred skills
ZEISS x-ray systems experience, ZEISS evaluation software experience, hands-on early-stage hardware testing, international travel readiness
Technologies
3D X-ray systems, ZEISS evaluation software
Responsibilities
Active technical support for customer new applications, system and software validation and documentation, development of new application guidelines, evaluation and interpretation of test results, technical feedback to development team, validation of test data and writing test reports
Seniority
Mid-level, hands-on IC