SFS Advanced Packaging Application Engineer
Core
Technical bridge between customers and R&D validating next-generation ZEISS 3D X-ray systems and developing advanced semiconductor packaging applications.
Role type
Application Engineer (Semiconductor Metrology)
Builds
3D X-ray systems for semiconductor manufacturing and advanced packaging
Domain
Semiconductor Manufacturing Technology / Optoelectronics
Required skills
3D X-ray systems expertise, semiconductor back-end processes knowledge, advanced packaging knowledge, test procedure generation, prototype troubleshooting, X-ray/CT industry experience, test data validation, technical documentation
Preferred skills
ZEISS x-ray systems experience, ZEISS evaluation software experience, hands-on hardware testing, customer-facing communication, international travel readiness
Technologies
3D X-ray systems, ZEISS evaluation software
Responsibilities
Active technical support for customer new applications and troubleshooting, Tests and validation of system and software capability, Development of new application guidelines, Evaluation of test results and suggestions for alternative implementations, Technical feedback to development team, Validate test data and write test reports
Seniority
Mid-level, hands-on IC