CareerPlan

Werkstudent Montage und Verpackung (m/w/x)

Wetzlar, DEFull-time2026-10-12 → 2026-11-14

Core

Assembling and packaging mechanical components, specifically simple transport covers, for ZEISS semiconductor manufacturing equipment.

Role type

Student worker (Werkstudent) in mechanical assembly and packaging

Builds

Mechanical subassemblies (transport covers) for lithography optics and process control systems

Domain

Semiconductor manufacturing equipment / Optics / Mechanical Engineering

Required skills

Mechanical assembly, Packaging, MS Office, Documentation, Organization

Preferred skills

Technical affinity, Proactive work style, Independent work

Technologies

MS Office

Responsibilities

Assemble and package mechanical components, Document and report on orders, Coordinate production orders with manufacturing control

Seniority

Student worker (Werkstudent)