Development Engineer – Adhesive Bonding Process Technology (f/m/x)
Core
Develop adhesive bonding processes and equipment for optomechanical assemblies used in semiconductor industry optics.
Role type
Development Engineer (Adhesive Bonding Process Technology)
Builds
Optomechanical assemblies and systems for semiconductor lithography optics
Domain
Semiconductor manufacturing equipment / Optomechanics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
adhesive bonding process development, adhesive application technologies, adhesive dispensing, fixture design, tolerance analysis, process validation, technical documentation
Preferred skills
optomechanical assembly knowledge, cleanroom environment experience
Technologies
adhesive dispensing systems, process control solutions
Responsibilities
Develop and validate adhesive bonding processes and fixtures, coordinate cross-functional collaboration for design and manufacturing, align technical requirements with customers and suppliers, perform tolerance analysis and budgeting
Seniority
Mid-level, hands-on IC