半導体製造装置部門アプリケーションエンジニア(SFS/Nagoya)
Core
Field Application Engineer optimizing and validating 3D Tomography FIB/SEM solutions for semiconductor labs and manufacturing facilities.
Role type
Field Application Engineer (FIB-SEM)
Builds
3D Tomography FIB/SEM solutions for semiconductor manufacturing
Domain
Semiconductor manufacturing / Materials analysis
Deliverable
physical/clinical work
Required skills
SEM imaging, FIB-SEM sample preparation, Semiconductor manufacturer experience, English communication, Japanese communication, Driver's license
Preferred skills
Material analysis tools (EDS, EBSD, Cryo systems), Semiconductor device analysis (DRAM, NAND), 3D Tomography (FIB-SEM), DOE, SPC, Master's or PhD in Engineering/Physics/Chemistry/Materials Science
Technologies
FIB-SEM, EDS, EBSD, Cryo systems
Responsibilities
Coordinate technical reviews and discussions with customers, Provide direct technical support and application knowledge at customer sites, Collaborate with internal hardware and software development teams, Conduct customer acceptance testing for new products, Perform troubleshooting and provide follow-up reports, Deliver application training and technical support, Conduct on-site demonstrations and tests using samples, Travel 50%+ of the time to US, Korea, and Japan
Seniority
Mid-level, hands-on IC