CareerPlan

Vice President, Technical Lead (Tungsten Suite)

Singapore Office OCCFull-time2026-10-29 → 2026-11-11

Core

Lead technical design and delivery for the Tungsten Suite platform, ensuring quality, security, and resilience while driving digital engineering strategy.

Role type

Senior IC Technical Lead (Financial Systems)

Builds

Tungsten Suite platform, digital engineering capabilities

Domain

Financial Services / Banking IT

Required skills

System analysis and design, Java/J2EE, React, Oracle DB, SQL, Unix/Linux, IBM WAS, DB2, MQ, IIB, Tungsten Suite, AI coding technologies (Co-pilot Dev-Ex), SDLC, Agile

Preferred skills

Strategic roadmap planning, stakeholder management, cost of ownership analysis

Technologies

Tungsten Suite, Java, J2EE, React, Oracle, DB2, MQ, IIB, IBM WAS, Co-pilot Dev-Ex

Responsibilities

Lead technical design based on standardization and security principles, develop technical specifications, support test plans (SIT/UAT), manage defects and change requests, transition systems to production, monitor system performance and risks, investigate incidents and root causes, plan application roadmap and secure funding

Seniority

Senior, hands-on IC