Packaging Process Engineer for Photonic Integrated Circuits (m/f/x)
Core
Develop and maintain production processes for photonic integrated circuits and electro-optical packaging, focusing on optical alignment for chip-chip and chip-fiber coupling.
Role type
Senior IC Packaging Process Engineer
Builds
High-performance optical alignment key components and electro-optical packaging solutions
Domain
Semiconductor manufacturing / Photonics / Quantum electronics
Required skills
Optical alignment, Photonic integrated circuits packaging, Hybrid manufacturing, Electro-optical measurement, Process automation, Software development, Optical integrated circuits design and debugging
Preferred skills
None stated
Technologies
None stated
Responsibilities
Define, design, and implement manufacturing processes for optical alignment; Develop manufacturing strategy and design goals for manufacturability and quality; Maintain and optimize process workflows and automation; Analyze manufacturing processes and failure modes to ensure quality and reliability
Seniority
Mid-level, hands-on IC