Principal, Printed Circuits Boards Manufacturing Engineer
Core
Own fabrication technology and supplier ecosystem for current and next-generation AI hardware, ensuring world-class time-to-market, cost, quality, and delivery.
Role type
Principal Printed Circuit Boards Manufacturing Engineer
Builds
High-performance AI hardware boards at scale
Domain
Semiconductor manufacturing / AI hardware / PCB fabrication
Deliverable
production ML models
Required skills
PCB DFM/DFA assessment, global supplier qualification and auditing, IPC standards compliance (IPC-6012, IPC-A-600, IPC-2221/2222, IPC-TM-650, IPC-4101), SPC metrics monitoring, DFMEA/PFMEA, 8D root-cause analysis, IST and CAF testing, high-layer-count (HLC) board design, HDI/microvias, sequential lamination, ultra-low-loss laminates, signal/power integrity, thermal management
Preferred skills
None stated
Technologies
None stated
Responsibilities
Perform PCB DFM/DFA assessments to mitigate yield and cost risk; Establish and enforce company-wide PCB design guidelines; Audit and qualify global PCB fabrication partners; Drive supplier process controls and continuous yield/cost improvements; Define IPC-compliant reliability standards; Monitor vendor SPC metrics; Evaluate advanced PCB materials and stackup technologies; Engage early with CAD, SI/PI, and sourcing teams to de-risk production
Seniority
Principal, hands-on IC
