Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center
Core
Ensure deposition and thermal process equipment is operational and baselined while supporting process integration with lithography and etch areas.
Role type
Equipment Engineer (Deposition and Thermal Process Development)
Builds
Advanced nano-fabrication equipment and thin-film deposition processes for university and corporate researchers.
Domain
Semiconductor manufacturing / Microelectronics / Thin-film deposition
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Vacuum systems, gas delivery systems, thermal processes, physical and plasma-based deposition techniques, equipment diagnostics, troubleshooting, component-level repair, thin-film characterization, metrology techniques, electrical characterization, cleanroom operations
Preferred skills
Sputtering, evaporation, ALD, furnaces, Rapid Thermal Process, CVD systems, lithography processes, scripting or data analysis tools, film stress engineering, adhesion layers, interface control
Technologies
Python, ellipsometry, profilometry, SEM, AFM, XRR, 4-point probe, Hall, probe station
Responsibilities
Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime and performance targets; Perform advanced diagnostics and root cause analysis for equipment-related issues affecting film quality; Support development and optimization of thin-film deposition processes and establish baseline recipes; Utilize metrology tools to characterize film thickness, uniformity, stress, adhesion, and morphology; Train users on equipment operation and develop standard operating procedures; Ensure safe operation of deposition systems including vacuum systems and high-voltage components.
Seniority
Mid-level, hands-on IC